| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Information disclosure when the ADSP payload size received in HLOS in response to Audio Stream Manager matrix session is less than this expected size. |
| Transient DOS in Bluetooth Host while rfc slot allocation. |
| Information disclosure in WLAN HAL while handling command through WMI interfaces. |
| Memory corruption in Kernel while parsing metadata. |
| Memory corruption while processing buffer initialization, when trusted report for certain report types are generated. |
| Memory corruption in WLAN Host when the firmware invokes multiple WMI Service Available command. |
| Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware. |
| Cryptographic issue in HLOS during key management. |
| Transient DOS may occur when processing vendor-specific information elements while parsing a WLAN frame for BTM requests. |
| Memory corruption while running NPU, when NETWORK_UNLOAD and (NETWORK_UNLOAD or NETWORK_EXECUTE_V2) commands are submitted at the same time. |
| Memory corruption in Audio while processing IIR config data from AFE calibration block. |
| Transient DOS while processing 11AZ RTT management action frame received through OTA. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Cryptographic issue in Automotive while unwrapping the key secs2d and verifying with RPMB data. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| Memory corruption in Audio during playback with speaker protection. |