| CVE |
Vendors |
Products |
Updated |
CVSS v3.1 |
| Transient DOS when processing a NULL buffer while parsing WLAN vdev. |
| Information disclosure when VI calibration state set by ADSP is greater than MAX_FBSP_STATE in the response payload to AFE calibration command. |
| Memory corruption while validating the TID to Link Mapping action request frame, when a station connects to an access point. |
| Memory corruption whhile handling the subsystem failure memory during the parsing of video packets received from the video firmware. |
| Transient DOS while processing multiple IKEV2 Informational Request to device from IPSEC server with different identifiers. |
| Information disclosure in WLAN HAL while handling command through WMI interfaces. |
| Transient DOS while parsing a vender specific IE (Information Element) of reassociation response management frame. |
| Memory corruption in TZ Secure OS while loading an app ELF. |
| Information disclosure while invoking callback function of sound model driver from ADSP for every valid opcode received from sound model driver. |
| Transient DOS while processing PDU Release command with a parameter PDU ID out of range. |
| Transient DOS while processing 11AZ RTT management action frame received through OTA. |
| Memory corruption in Core when updating rollback version for TA and OTA feature is enabled. |
| Transient DOS while parsing ieee80211_parse_mscs_ie in WIN WLAN driver. |
| Memory corruption when IPv6 prefix timer object`s lifetime expires which are created while Netmgr daemon gets an IPv6 address. |
| Memory corruption in TZ Secure OS while requesting a memory allocation from TA region. |
| Memory corruption in HLOS while running playready use-case. |
| Transient DOS in Data Modem during DTLS handshake. |
| Possible use after free when process shell memory is freed using IOCTL call and process initialization is in progress in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking |
| Memory corruption due to use after free issue in kernel while processing ION handles in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables |
| The session index variable in PCM host voice audio driver initialized before PCM open, accessed during event callback from ADSP and reset during PCM close may lead to race condition between event callback - PCM close and reset session index causing memory corruption. |