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CVEs in KEV CVEs with EPSS >= 80% Crit. Microsoft High Apache SQL Injection (CWE-89) Linux Kernel High (CVSS 3.1) Apache Struts RCE (Remote Code Execution) XSS (CWE-79) Critical (CVSS 4.0) CVEs to check

Search Results (772 CVEs found)

CVE Vendors Products Updated CVSS v3.1
CVE-2017-18279 1 Qualcomm 78 Fsm9055, Fsm9055 Firmware, Fsm9955 and 75 more 2024-11-21 7.8 High
Lack of check of buffer length before copying can lead to buffer overflow in camera module in Small Cell SoC, Snapdragon Mobile, Snapdragon Wear in FSM9055, FSM9955, IPQ4019, IPQ8064, MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016.
CVE-2017-18173 1 Qualcomm 26 Sd 425, Sd 425 Firmware, Sd 427 and 23 more 2024-11-21 N/A
In case of using an invalid android verified boot signature with very large length, an integer underflow occurs in Snapdragon Mobile in SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 810, SD 820, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
CVE-2017-18141 1 Qualcomm 68 Ipq8074, Ipq8074 Firmware, Mdm9206 and 65 more 2024-11-21 N/A
When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.
CVE-2017-18131 1 Qualcomm 56 Mdm9206, Mdm9206 Firmware, Mdm9607 and 53 more 2024-11-21 N/A
In QTEE, an incorrect fuse value can be blown in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 820, SD 820A, SD 835, SD 845, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016.
CVE-2017-15841 1 Qualcomm 32 Sd 410, Sd 410 Firmware, Sd 412 and 29 more 2024-11-21 N/A
When HOST sends a Special command ID packet, Controller triggers a RAM Dump and FW reset in Snapdragon Mobile in version SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 835, Snapdragon_High_Med_2016.
CVE-2017-11004 1 Qualcomm 74 Ipq8074, Ipq8074 Firmware, Mdm9206 and 71 more 2024-11-21 N/A
A non-secure user may be able to access certain registers in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016.
CVE-2024-33014 1 Qualcomm 653 315 5g Iot Modem, 315 5g Iot Modem Firmware, 860 Mobile Platform and 650 more 2024-11-20 7.5 High
Transient DOS while parsing ESP IE from beacon/probe response frame.
CVE-2024-33015 1 Qualcomm 393 Ar8035, Ar8035 Firmware, Csr8811 and 390 more 2024-11-20 7.5 High
Transient DOS while parsing SCAN RNR IE when bytes received from AP is such that the size of the last param of IE is less than neighbor report.
CVE-2024-33025 1 Qualcomm 340 Csr8811, Csr8811 Firmware, Fastconnect 6800 and 337 more 2024-11-20 7.5 High
Transient DOS while parsing the BSS parameter change count or MLD capabilities fields of the ML IE.
CVE-2024-33024 1 Qualcomm 364 Ar8035, Ar8035 Firmware, Csr8811 and 361 more 2024-11-20 7.5 High
Transient DOS while parsing the ML IE when a beacon with length field inside the common info of ML IE greater than the ML IE length.
CVE-2024-33018 1 Qualcomm 303 Ar8035, Ar8035 Firmware, Csr8811 and 300 more 2024-11-20 7.5 High
Transient DOS while parsing the received TID-to-link mapping element of the TID-to-link mapping action frame.
CVE-2024-33026 1 Qualcomm 332 Ar8035, Ar8035 Firmware, Csr8811 and 329 more 2024-11-20 7.5 High
Transient DOS while parsing probe response and assoc response frame when received frame length is less than max size of timestamp.
CVE-2024-33023 1 Qualcomm 317 Ar8035, Ar8035 Firmware, Csra6620 and 314 more 2024-11-20 8.4 High
Memory corruption while creating a fence to wait on timeline events, and simultaneously signal timeline events.
CVE-2024-33022 1 Qualcomm 251 Ar8035, Ar8035 Firmware, Csra6620 and 248 more 2024-11-20 8.4 High
Memory corruption while allocating memory in HGSL driver.
CVE-2024-33021 1 Qualcomm 279 Ar8035, Ar8035 Firmware, Csra6620 and 276 more 2024-11-20 8.4 High
Memory corruption while processing IOCTL call to set metainfo.
CVE-2024-33020 1 Qualcomm 198 Ar8035, Ar8035 Firmware, Fastconnect 6700 and 195 more 2024-11-20 7.5 High
Transient DOS while processing TID-to-link mapping IE elements.
CVE-2024-33019 1 Qualcomm 299 Ar8035, Ar8035 Firmware, Csr8811 and 296 more 2024-11-20 7.5 High
Transient DOS while parsing the received TID-to-link mapping action frame.
CVE-2024-33028 1 Qualcomm 279 Ar8035, Ar8035 Firmware, Csra6620 and 276 more 2024-11-20 8.4 High
Memory corruption as fence object may still be accessed in timeline destruct after isync fence is released.
CVE-2024-33027 1 Qualcomm 184 205 Mobile Platform, 205 Mobile Platform Firmware, 215 Mobile Platform and 181 more 2024-11-20 8.4 High
Memory corruption can occur when arbitrary user-space app gains kernel level privilege to modify DDR memory by corrupting the GPU page table.
CVE-2024-33034 1 Qualcomm 213 Fastconnect 6200, Fastconnect 6200 Firmware, Fastconnect 6700 and 210 more 2024-11-20 8.4 High
Memory corruption can occur if VBOs hold outdated or invalid GPU SMMU mappings, especially when the binding and reclaiming of memory buffers are performed at the same time.